The primary reason to use the software is to program . A typical BGA reflow profile consists of several segments defined by Ramp Rate (r) , Target Temperature (L) , and Dwell/Hold Time (d) . Target Temp (Leaded) Target Temp (Lead-Free) 1. Preheat Slowly warms the chip and board to prevent thermal shock. 100°C–120°C 130°C–150°C 2. Soak Activates the flux and ensures uniform heat distribution. 140°C–150°C 150°C–180°C 3. Ramp Rapidly climbs toward the melting point of the solder. 160°C–170°C 190°C–210°C 4. Reflow Reaches peak temperature to liquify the solder balls. 185°C–190°C 225°C–235°C 5. Cooling Solidifies the solder safely to avoid brittle joints. Controlled drop Controlled drop How to Program a Profile in the Software: Open the Profile Editor in ACHI IR Soft. Input your parameters into the matrix. For example: r1 = 1.00 (Raise temperature by 1°C per second) L1 = 120 (Target 120°C) d1 = 40 (Hold at 120°C for 40 seconds) Repeat this process for segments 2 through 5.
A professional profile consists of four key stages: .
Visually monitors actual temperatures against your target profile.
The term most commonly refers to the driver, firmware, and utility suite required to operate the Achi IR6500 series of infrared rework stations. Achi is a well-known brand in the electronics repair industry, manufacturing BGA (Ball Grid Array) rework equipment used for soldering and desoldering IC chips on printed circuit boards (PCBs).