The climatic sequence, temperature/humidity cycling, and vibration tests mimic years of use in a few days of laboratory testing. A joint that passes these tests is highly likely to survive in the field. Without formal qualification, you are essentially guessing.
Solderless wound connections (also known as "wire-wrap" or "termination wrapping") are fundamental in electromagnetic components. Unlike soldered joints, which introduce thermal stress and potential for cold joints, or crimped connections, which require specialized tooling for each wire size, the wound connection relies entirely on controlled tensile stress and gas-tight contact zones. IEC 60352-5 standardizes this process to ensure reproducibility across manufacturing environments. iec 60352-5 pdf
The standard specifies rules for the pins being pressed into the board. These typically fall into two categories: Solderless wound connections (also known as "wire-wrap" or
Creates a gas-tight interface that resists corrosion, outperforming traditional solder joints in high-vibration environments. How to Access the IEC 60352-5 PDF The standard specifies rules for the pins being
If your organisation subscribes to a standards portal (e.g., IHS Markit, Techstreet, Intertek Inform), you can often access the PDF through your existing subscription.