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Separates thermal profile drift caused by machine wear from issues caused by board layout changes.

| Section | Title | | :--- | :--- | | 1 | GENERAL | | 2 | APPLICABLE DOCUMENTS | | 3 | TERMS AND DEFINITIONS | | 4 | THERMAL PROFILES - SnPb AND Pb-FREE | | 5 | GOLDEN BOARD DESIGN FOR PROCESS VERIFICATIONS | | 6 | PROFILING EQUIPMENT REQUIREMENTS | | 7 | THERMOCOUPLES | | 8 | VERIFICATION PROFILING FREQUENCY | | 9 | REQUIREMENTS FOR OVEN REPEATABILITY CALCULATIONS | | 10 | MAINTENANCE AND CALIBRATION GUIDELINES | Ipc-7801 Pdf

: The authoritative guide for the rework, repair, and modification of electronic assemblies. Amazon.com Accessing the Standard Separates thermal profile drift caused by machine wear