Includes advanced power-saving modes like DeepSleep and Hibern8. 2. Physical and Mechanical Dimensions
: Typically 11.5mm x 13.0mm with a thickness around 1.0mm.
Specific power rails dedicated exclusively to the volatile memory. 4. Electrical and Thermal Characteristics Ufs Bga 254 Datasheet
REFCLKP/N (Reference Clock), TXP/N (Transmit), and RXP/N (Receive). Power Pins: VCCcap V sub cap C cap C end-sub (Flash Power, e.g., 3.0V), VCCQcap V sub cap C cap C cap Q end-sub (IO Power, e.g., 1.2V), and VCCQ2cap V sub cap C cap C cap Q 2 end-sub
UFS devices utilize up to two lanes for transmission (TX) and two lanes for reception (RX). Specific power rails dedicated exclusively to the volatile
The refers to a Ball Grid Array surface-mount packaging with 254 solder balls arranged on the underside of the integrated circuit (IC). It is specifically designed to facilitate high-speed, serial differential signaling between the flash storage and the mobile System-on-Chip (SoC).
: Full-duplex differential serial LVDS interface (M-PHY), allowing simultaneous read and write. Data Rates : Targets speeds of 2.9 Gbit/s per lane , scalable up to 5.8 Gbit/s Operating Voltage : Typically requires VCC (2.95V) VCCQ/VCCQ2 (1.2V/1.8V) for low-power operation. dfsimg1.hqewimg.com 2. Physical & Mechanical Data Package Type : Ball Grid Array (BGA). Ball Count : 254 pins/balls. Footprint Dimensions : Common body sizes for this footprint are approximately 11.5mm x 13mm 15mm x 13mm Thermal Tolerance Power Pins: VCCcap V sub cap C cap C end-sub (Flash Power, e
If the BGA 254 datasheet specifies an MCP (e.g., uMCP), a vast majority of the remaining balls are dedicated to the high-speed LPDDR interface: Differential clock inputs for the DRAM. CA[5:0]: Command/Address inputs. DQ[31:0]: Data bus pins for 32-bit channel configurations. DMI[3:0]: Data Mask / Inversion signals.